Solder engineering for optoelectronic packaging
- 1 June 1994
- journal article
- optoelectronic
- Published by Springer Nature in JOM
- Vol. 46 (6) , 46-50
- https://doi.org/10.1007/bf03220719
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- An automated flip-chip assembly technology for advanced VLSI packagingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- A compact multichannel transceiver module using planar-processed optical waveguides and flip-chip optoelectronic componentsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Study of soldering for VLSI/FLC spatial light modulatorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- High performance optical datalink array technologyIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993