Analysis and optimization of the dynamic response of a rectangular plate to a shock load acting on its support contour, with application to portable electronic packages
- 17 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1037-1049
- https://doi.org/10.1109/ectc.1994.367500
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Dynamic characterization of surface mount component leads for solder joint inspectionPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Nonlinear dynamic response of a flexible thin plate to constant acceleration applied to its support contour, with application to printed circuit boards, used in avionic packagingInternational Journal of Solids and Structures, 1992
- Response of a Flexible Printed Circuit Board to Periodic Shock Loads Applied to its Support ContourJournal of Applied Mechanics, 1992
- Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic ComponentsJournal of Electronic Packaging, 1991
- Structural Analysis in Microelectronic and Fiber-Optic SystemsPublished by Springer Nature ,1991