SUBMICRON PARTICLE REMOVAL USING ULTRASONIC CLEANING

Publisher Website
Google Scholar
Abstract
The effectiveness of the ultrasonic cleaning technique in removing submicron particles is investigated. The effect of the particle size, frequency, ultrasonic time functions and liquid temperature on the removal efficiency is presented. Transducers with a frequency of 40 kHz and a bandwidth of 1 kHz were used. The results indicate that the microstreaming effects produced by sound waves play a major role in removing submicron particles from silicon wafers. Cavitation damage to the wafer surface have been observed under certain parameters. Line lifting from a patterned wafer has also been observed under certain conditions. The results show that the ultrasonic cleaning technique is capable of removing particle sizes of 0.3 microns or larger.

This publication has 5 references indexed in Scilit: