Statistics of successive breakdown events for ultra-thin gate oxides
- 26 June 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
The first oxide breakdown event does not always cause the device or chip failure. In this work, a simple analytical physics-based model is proposed to describe the statistics of successive breakdown events in gate insulators. The results are tested using grouping experiments based on very large sample size statistics. These results are relevant to the reliability of circuit applications where the device (and/or the chip) tolerates several breakdown events without causing device/circuit malfunction. Approximate Weibull distributions valid at the low percentiles relevant to reliability extrapolation are also presented.Keywords
This publication has 2 references indexed in Scilit:
- New physics-based analytic approach to the thin-oxide breakdown statisticsIEEE Electron Device Letters, 2001
- The gate oxide lifetime limited by `B-mode' stress induced leakage current and the scaling limit of silicon dioxides in the direct tunnelling regimeSemiconductor Science and Technology, 2000