Multilevel Metallization
- 1 January 1992
- book chapter
- Published by Elsevier
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
- Diffusion Barriers - For Thin Film MetallizationsDefect and Diffusion Forum, 1991
- Selective Electroless Metal Deposition for Integrated Circuit FabricationJournal of the Electrochemical Society, 1989
- Diffusion of Metals in Silicon DioxideJournal of the Electrochemical Society, 1986
- Selective Low Pressure Chemical Vapor Deposition of TungstenJournal of the Electrochemical Society, 1984
- A VLSI Bipolar Metallization Design with Three-Level Wiring and Area Array Solder ConnectionsIBM Journal of Research and Development, 1982
- Diffusion barriers in thin filmsThin Solid Films, 1978
- Study of planarized sputter-deposited SiO2Journal of Vacuum Science and Technology, 1978