Flip-chip solder bond mounting of laser diodes
- 14 March 1991
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 27 (6) , 499-501
- https://doi.org/10.1049/el:19910314
Abstract
The successful hybrid mounting of semiconductor laser diode chips by flip-chip solder bonding is reported. This technique allows accurate chip placement with submicron positioning, and has demonstrated acceptable heat dissipation characteristics.Keywords
This publication has 1 reference indexed in Scilit:
- Self-aligned flip-chip assembly of protonic devices with electrical and optical connectionsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990