REVERSIBLE HILLOCK GROWTH IN THIN FILMS
- 1 October 1969
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 15 (7) , 234-235
- https://doi.org/10.1063/1.1652982
Abstract
Thin films of lead and aluminum on substrates of lower thermal expansion coefficient were examined using a hot stage in a scanning electron microscope. Hillocks were seen to grow as the temperature was increased and then to shrink as the temperature slowly fell. This effect is thought to be caused by a change from compressive into tensile stress in the film.Keywords
This publication has 2 references indexed in Scilit:
- Hillock Growth and Stress Relief in Sputtered Au FilmsJournal of Applied Physics, 1969
- Thermal Cycling and Surface Reconstruction in Aluminum Thin FilmsJournal of the Electrochemical Society, 1969