Quality Issues in Chip‐on‐board (COB) Technology
- 1 February 1994
- journal article
- Published by Emerald Publishing in Microelectronics International
- Vol. 11 (2) , 5-10
- https://doi.org/10.1108/eb044525
Abstract
Critical processing steps of COB manufacturing, as implemented at Epitek, are reported. They include testing of incoming boards, cleaning, bonding parameters, bonding defects and statistical process control.Keywords
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