Discussion of “Interpretation of thermal grooving data for copper”
- 1 January 1970
- journal article
- research article
- Published by Springer Nature in Metallurgical Transactions
- Vol. 1 (1) , 315-317
- https://doi.org/10.1007/bf02819285
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- The kinetics of grain boundary grooving in copperPublished by Elsevier ,2003
- Surface self‐diffusion measurements on copperPhysica Status Solidi (b), 1968
- The surface self-diffusion of copper as affected by environmentActa Metallurgica, 1964
- Self-Diffusion in CopperPhysical Review B, 1954