Application of JVD nitride gate dielectric to a 0.35 micron CMOS process for reduction of gate leakage current and boron penetration
- 22 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 647-650
- https://doi.org/10.1109/iedm.1997.650467
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Ultra-thin Silicon Nitride Gate Dielectric For Deep-sub-micron CMOS DevicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1997
- Highly Reliable Silicon Nitride Thin Films Made by Jet Vapor DepositionJapanese Journal of Applied Physics, 1995