Quantum Tunneling as an Elementary Fracture Process
- 1 August 1971
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 42 (9) , 3479-3486
- https://doi.org/10.1063/1.1660757
Abstract
A quantum‐mechanical model for an elementary fracture process is proposed. The mechanism is driven by the local applied stress acting upon a chemical bond causing it to decompose. The bond tunnels from an initial bonded state to a final unbound state. The rate of this process is independent of temperature at low temperatures. It can be assisted, however, by phonons, photons, chemical potentials, and other excitations or driving forces. It is shown that the predictions of the model are in agreement with the effects of stress on rupture times, crack velocities, and rates of free radical formation. The observed temperature dependence of the fracture strength of Al2O3 is also predicted by the model.This publication has 8 references indexed in Scilit:
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