Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization
Top Cited Papers
- 1 April 2004
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 52 (7) , 2047-2056
- https://doi.org/10.1016/j.actamat.2003.12.042
Abstract
No abstract availableKeywords
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