Preparation of Metallic Films on Elastomeric Stamps and Their Application for Contact Processing and Contact Printing
- 5 February 2003
- journal article
- research article
- Published by Wiley in Advanced Functional Materials
- Vol. 13 (2) , 145-153
- https://doi.org/10.1002/adfm.200390021
Abstract
The formation of permanent or reversible metallic patterns on a substrate has applications in microfabrication and analytical techniques. Here, we investigate how to metallize an elastomeric stamp, either for processing of a substrate mediated by the proximity between the metal on the stamp and an active layer on the substrate, or for contact printing of the metal from a stamp to a substrate. The stamps were made from poly(dimethylsiloxane) (PDMS) and were modified before metallizing them with Au by adding to or removing from their bulk mobile silicone residues, by oxidizing their surface with an O2‐plasma, by surface‐fluorination via silanization, or by priming them with a Ti layer. The interplay between the adhesion of the different layers defines two categories of application: contact processing and contact printing. Contact processing corresponds to keeping the metal on the stamp after contacting a substrate; it is reversible and nondestructive, and useful to define transient electrical contacts or quench fluorescence on a surface, for example. Contact printing occurs when the metal on the stamp adheres to the printed surface. Contact printing can transfer a metal, layers of metals, or an oxide onto a substrate with submicrometer lateral resolution. The transfer can be total or localized to the regions of contact, depending on the morphology of the metal on the stamp and/or the surface chemistry of the substrate.Keywords
This publication has 44 references indexed in Scilit:
- Time scales for cold welding and the origins of stick-slip frictionPhysical Review B, 2002
- Nanolithography based on patterned metal transfer and its application to organic electronic devicesApplied Physics Letters, 2002
- Microcontact Printing of Alkanephosphonic Acids on Aluminum: Pattern Transfer by Wet Chemical EtchingLangmuir, 1999
- Using an elastomeric phase mask for sub-100 nm photolithography in the optical near fieldApplied Physics Letters, 1997
- Interactions and penetration at metal/self-assembled organic monolayer interfacesJournal of Vacuum Science & Technology A, 1996
- Imprint Lithography with 25-Nanometer ResolutionScience, 1996
- Morphology-Induced Oscillations of the Magnetic Anisotropy in Ultrathin Co FilmsPhysical Review Letters, 1996
- Patterning of dielectric oxide thin layers by microcontact printing of self-assembled monolayersJournal of Materials Research, 1995
- Contact Adhesion of Thin Gold Films on Elastomeric Supports: Cold Welding Under Ambient ConditionsScience, 1991
- Silicon-on-Insulator Wafer Bonding-Wafer Thinning Technological EvaluationsJapanese Journal of Applied Physics, 1989