Microstructure changes in Sn-3.5Ag solder alloy during creep
- 1 December 1998
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 27 (12) , 1367-1371
- https://doi.org/10.1007/s11664-998-0099-y
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Constitutive relations for tin-based solder jointsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992