Endpoint detection method for CMP of copper
- 31 January 2000
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 50 (1-4) , 411-416
- https://doi.org/10.1016/s0167-9317(99)00309-3
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Characterization of Cu chemical mechanical polishing by electrochemical investigationsMicroelectronic Engineering, 1997
- Chemical mechanical polishing of copper for multilevel metallizationApplied Surface Science, 1995