Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging
- 1 October 2001
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 30 (10) , 1317-1322
- https://doi.org/10.1007/s11664-001-0118-8
Abstract
No abstract availableKeywords
This publication has 16 references indexed in Scilit:
- Development and validation of a lead-free alloy for solder paste applicationsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 1997
- Application of lead-free eutectic Sn-Ag solder in no-clean thick film electronic modulesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1994
- New, lead-free soldersJournal of Electronic Materials, 1994
- The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder jointsJournal of Electronic Materials, 1994
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994
- New Pb-free solder alloy with superior mechanical propertiesApplied Physics Letters, 1993
- Developing lead-free solders: A challenge and opportunityJOM, 1993
- Converting to lead-free solders: An automotive industry perspectiveJOM, 1993
- Strength of tin-based soldered jointsJournal of Materials Science, 1992
- Solder Joint Reliability—Can Solder Creep?Soldering & Surface Mount Technology, 1990