Polymeric conductive pastes as solder replacement for flip-chip attachment
- 1 November 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 21 (4) , 382-393
- https://doi.org/10.1109/96.730422
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading. II. Using alloy 42 as leadframe materialIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1997
- Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loadingIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996
- Stress fields near the corner of jointed dissimilar materials.TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 1991
- A stress singularity parameters approach for evaluating adhesive strength.TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 1988
- Stress singularities in cracked composite full-planesInternational Journal of Fracture, 1977
- Stress Singularities Resulting From Various Boundary Conditions in Angular Corners of Plates in ExtensionJournal of Applied Mechanics, 1952