Abstract
This work evaluates four bipolar technologies that are currently competing to become, or remain as, the preferred bipolar technology for the commercial development of linear handset power amplifier modules. The four technologies are: GaAs HBT, Si BJT, SiGe HBT, and InP HBT. The purpose of this work is to evaluate each of these competing technologies in terms of linear handset PA requirements (i.e. P/sub OUT/, ACPR, PAE, P/sub GAIN/, and ruggedness).

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