Stresses in UHV Planar Magnetron Sputtered Films
- 1 January 1991
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Stress in sputtered Mo thin films: The effect of the discharge voltageJournal of Vacuum Science & Technology A, 1991
- UHV sputter deposition with a research-scale DC magnetronJournal of Physics E: Scientific Instruments, 1988
- The influence of discharge current on the intrinsic stress in Mo films deposited using cylindrical and planar magnetron sputtering sourcesJournal of Vacuum Science & Technology A, 1985
- Calculations of thermalization during the sputter deposition processVacuum, 1984
- The thermalization of energetic atoms during the sputtering processJournal of Vacuum Science & Technology A, 1984
- Calculation of deposition rates in diode sputtering systemsJournal of Vacuum Science and Technology, 1978
- Internal stresses in titanium, nickel, molybdenum, and tantalum films deposited by cylindrical magnetron sputteringJournal of Vacuum Science and Technology, 1977
- Selective thermalization in sputtering to produce high TcfilmsIEEE Transactions on Magnetics, 1975
- Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatingsJournal of Vacuum Science and Technology, 1974