Interface Study on GaAs-on-Si by Transmission Electron Microscopy

Abstract
A correlation between the surface and interface defects in GaAs-on-Si structures was examined by KOH etching and transmission electron microscopy. Line-shaped etch pits revealed on the GaAs-on-Si (100) were attributed to twins produced at the interface. This twin generation was avoided by off-setting the substrate orientation. An alternative for this is the application of an additional heat treatment after the GaAs buffer layer is grown. In this case, the twin propagation ends on the buffer layer.