Surface encapsulation for low-loss silicon photonics
- 24 September 2007
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 91 (13) , 131117
- https://doi.org/10.1063/1.2793820
Abstract
Encapsulation layers are explored for passivating the surfaces of silicon to reduce optical absorption in the wavelength band. Surface-sensitive test structures consisting of microdisk resonators are fabricated for this purpose. Based on previous work in silicon photovoltaics, coatings of and are applied under varying deposition and annealing conditions. A short dry thermal oxidation followed by a long high-temperature anneal is found to be most effective at long-term encapsulation and reduction of interface absorption. Minimization of the optical loss is attributed to simultaneous reduction in sub-band-gap silicon surface states and hydrogen in the capping material.
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