Diffusion barrier properties of TaC between Si and Cu
- 1 June 1997
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 301 (1-2) , 142-148
- https://doi.org/10.1016/s0040-6090(97)00057-6
Abstract
No abstract availableThis publication has 19 references indexed in Scilit:
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