Tantalum-based diffusion barriers in Si/Cu VLSI metallizations
- 1 August 1991
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 70 (3) , 1369-1373
- https://doi.org/10.1063/1.349594
Abstract
No abstract availableThis publication has 15 references indexed in Scilit:
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