Creating 3D circuits using transferred films
- 1 January 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Circuits and Devices Magazine
- Vol. 13 (6) , 27-30
- https://doi.org/10.1109/101.646556
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Architectural design of a three dimensional FPGAPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Performance modeling of the interconnect structure of a 3-dimensionally integrated RISC-processor/cache-systemPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Performance improvement of the memory hierarchy of RISC-systems by application of 3-D-technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Monolithic integration of a light-emitting diode array and a silicon circuit using transfer processesApplied Physics Letters, 1993
- Fabrication of three-dimensional IC using `cumulatively bonded IC' (CUBIC) technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1990
- Multilayer CMOS device fabricated on laser recrystallized silicon islandsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1983