Film-thickness considerations in microcantilever-beam test in measuring mechanical properties of metal thin film
- 1 August 2003
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 437 (1-2) , 182-187
- https://doi.org/10.1016/s0040-6090(03)00645-x
Abstract
No abstract availableKeywords
This publication has 21 references indexed in Scilit:
- A reaction-layer mechanism for the delayed failure of micron-scale polycrystalline silicon structural films subjected to high-cycle fatigue loadingActa Materialia, 2002
- Fracture toughness of polysilicon MEMS devicesSensors and Actuators A: Physical, 2000
- Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivationJournal of Materials Research, 1998
- Thickness dependent mechanical behavior of submicron aluminum filmsJournal of Electronic Materials, 1997
- Separation of film thickness and grain boundary strengthening effects in Al thin films on SiJournal of Materials Research, 1992
- Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin filmsJournal of Materials Research, 1988
- Fracture testing of silicon microelements i n s i t u in a scanning electron microscopeJournal of Applied Physics, 1988
- Hall-petch relation in thin film metallizationsScripta Metallurgica, 1986
- A simple technique for the determination of mechanical strain in thin films with applications to polysiliconJournal of Applied Physics, 1985
- Local Flexibility Coefficients for the Built-In Ends of Beams and PlatesJournal of Engineering for Industry, 1969