A reaction-layer mechanism for the delayed failure of micron-scale polycrystalline silicon structural films subjected to high-cycle fatigue loading
- 25 July 2002
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 50 (14) , 3579-3595
- https://doi.org/10.1016/s1359-6454(02)00158-1
Abstract
No abstract availableKeywords
This publication has 34 references indexed in Scilit:
- High-cycle fatigue of single-crystal silicon thin filmsJournal of Microelectromechanical Systems, 2001
- High-cycle fatigue and durability of polycrystalline silicon thin films in ambient airSensors and Actuators A: Physical, 2001
- Fracture toughness of polysilicon MEMS devicesSensors and Actuators A: Physical, 2000
- Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimensProceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, 1999
- Subcritical crack growth in silicon MEMSJournal of Microelectromechanical Systems, 1999
- Mechanisms of fatigue-crack propagation in ductile and brittle solidsInternational Journal of Fracture, 1999
- Fatigue of MaterialsPublished by Cambridge University Press (CUP) ,1998
- Fracture and fatigue behavior of single crystal silicon microelements and nanoscopic AFM damage evaluationMicrosystem Technologies, 1998
- Slow Crack Growth in Single-Crystal SiliconScience, 1992
- Cyclic Fatigue of CeramicsJournal of the Ceramic Society of Japan, 1991