Application of plasma etching techniques to metal-oxide-semiconductor (MOS) processing
- 1 January 1980
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 65 (1) , 111-123
- https://doi.org/10.1016/0040-6090(80)90063-2
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Fabrication of deep square wave structures with micron dimensions by reactive sputter etchingApplied Physics Letters, 1978
- The Loading Effect in Plasma EtchingJournal of the Electrochemical Society, 1977
- Pathways in device lithographyIEEE Transactions on Electron Devices, 1975
- Etching Characteristics of Silicon and its Compounds by Gas PlasmaJapanese Journal of Applied Physics, 1973