Silicon Thin-Film Formation by Direct Photochemical Decomposition of Disilane
- 1 January 1983
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 22 (1A) , L46-48
- https://doi.org/10.1143/jjap.22.l46
Abstract
Silicon thin-films have been deposited by the direct photolysis of disilane at a substrate temperature below 300°C. The growth rate depends on irradiation intensity of a low pressure mercury-lamp, and a typical rate of 15 Å/min has been obtained under ∼0.08 watts/cm2 illumination, regardless of substrate temperature. The deposited films are composed of an amorphous network containing bonded-hydrogen in the range 6–9 at.%. The bonding configurations of SiH groups varied from silicon dihydride to monohydride with increasing substrate temperature, and correspondingly the dark conductivity decreased from 10-7 to 10-11 Ω-1cm-1. A broad photoluminescence peak at 1.4 eV was observed for a specimen grown at 200°C.Keywords
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