Investigation of interconnect capacitance characterization using charge-based capacitance measurement (CBCM) technique and three-dimensional simulation
- 1 March 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Journal of Solid-State Circuits
- Vol. 33 (3) , 449-453
- https://doi.org/10.1109/4.661210
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Analysis And Justification Of A Practical 2 L/2-d Capacitance Extraction MethodologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- An on-chip, attofarad interconnect charge-based capacitance measurement (CBCM) techniquePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- HIVE: an efficient interconnect capacitance extractor to support submicron multilevel interconnect designsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Efficient extraction of metal parasitic capacitancesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Interconnect scaling-the real limiter to high performance ULSIPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002