Anisotropic conductive adhesive films for flip-chip interconnection onto organic substrates
- 27 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Multi-Chip and Bare Chip Packaging Technologies. Bare-Chip Technology Using Anisotropic Conductive Films.The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits, 1997
- FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMSJournal of Electronics Manufacturing, 1995