Thermal resistance at metal/diamond interfaces in relation to the mounting of microwave diodes

Publisher Website
Google Scholar
Abstract
The thermal resistances of samples with various kinds of metal/diamond interface have been measured at about 400K with a radiation detector. The results are analysed in terms of series resistances due to the change from electron to phonon conduction and due to the non-ideal thermal compression bonding technique. The first of these is at least five times smaller than previously thought and is in accordance with the practical improvements obtained in the use of diamonds as heat sinks.