Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems
- 1 January 2001
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 30 (1) , 35-44
- https://doi.org/10.1007/s11664-001-0212-y
Abstract
No abstract availableKeywords
This publication has 25 references indexed in Scilit:
- Direct correlation between mechanical failure and metallurgical reaction in flip chip solder jointsJournal of Applied Physics, 1999
- The role of intermetallic compounds in lead‐free solderingSoldering & Surface Mount Technology, 1998
- Eutectic Sn/Pb solder bump and under bump metallurgy: interfacial reactions and adhesionSoldering & Surface Mount Technology, 1998
- The local nominal composition-useful concept for microjoining and interconnection applicationsScripta Materialia, 1997
- Effect of aging on fatigue crack growth at sn-pb/cu interfacesMetallurgical and Materials Transactions A, 1995
- Diffusion controlled reactions in Au/Pb–Sn solder systemMaterials Science and Technology, 1992
- Scanning Electron Microscopy and Energy Dispersive X-ray (SEM/EDX) Characterization of Solder Solderability and ReliabilityPublished by Springer Nature ,1991
- Constitution of Au–AuSn–Pb partial ternary systemMaterials Science and Technology, 1987
- The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solderJournal of Electronic Materials, 1987
- Constitution of AuSn–Pb–Sn partial ternary systemMaterials Science and Technology, 1985