Recent humidity accelerations, a base for testing standards
- 1 May 1991
- journal article
- Published by Wiley in Quality and Reliability Engineering International
- Vol. 7 (3) , 169-180
- https://doi.org/10.1002/qre.4680070308
Abstract
No abstract availableKeywords
This publication has 16 references indexed in Scilit:
- Reliability of plastic‐encapsulated logic circuitsQuality and Reliability Engineering International, 1989
- Investigations of Large PLCC Package Cracking During Surface Mount ExposureIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Comprehensive Model for Humidity Testing Correlation8th Reliability Physics Symposium, 1986
- Automatically Controlled 2-Vessel Pressure-Cooker Test-EquipmentIEEE Transactions on Reliability, 1983
- Rapid Assessment of the Humidity Dependence of IC Failure Modes by Use of HAST8th Reliability Physics Symposium, 1983
- Highly Accelerated Temperature and Humidity Stress Test Technique (HAST)8th Reliability Physics Symposium, 1981
- Moisture Uptake and Release by Plastic Molding Compoundsits Relationship to System Life and Failure Mode8th Reliability Physics Symposium, 1980
- Metallization Corrosion in Silicon Devices by Moisture-Induced Electrolysis8th Reliability Physics Symposium, 1974
- Reliability Aspects of Plastic Encapsulated Integrated Circuits8th Reliability Physics Symposium, 1972
- The I.C. Plastic Package a Simple Method for Predicting Package Performance8th Reliability Physics Symposium, 1972