System design optimization for MCM-D/flip-chip
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 18 (4) , 620-627
- https://doi.org/10.1109/96.475267
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Integral decoupling capacitance reduces multichip module ground bouncePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Impact of packaging technology on system partitioning: a case studyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Conceptual Design of Multichip Modules and SystemsPublished by Springer Nature ,1994
- Design for packageability-early consideration of packaging from a VLSI designer's viewpointComputer, 1993
- A 200-MHz 64-b dual-issue CMOS microprocessorIEEE Journal of Solid-State Circuits, 1992
- Electronic system packaging: the search for manufacturing the optimum in a sea of constraintsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990