Electronic system packaging: the search for manufacturing the optimum in a sea of constraints
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (3) , 494-508
- https://doi.org/10.1109/33.58851
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- ForewordJournal of Electronic Materials, 1989
- Circuit layout and yieldIEEE Journal of Solid-State Circuits, 1988
- A Josephson 4b MicroprocessorPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1988
- Challenges in advanced semiconductor technology in the ulsl era for computer applicationsJournal of Electronic Materials, 1987
- Computing Inductive Noise of Chip PackagesAT&T Bell Laboratories Technical Journal, 1984
- The hemt: A superfast transistor: An experimental GaAs-AlGoAs device switches in picoseconds and generates little heat. This is just what supercomputers needIEEE Spectrum, 1984
- Placement and average interconnection lengths of computer logicIEEE Transactions on Circuits and Systems, 1979
- A General Method for Obtaining Impedance and Coupling Characteristics of Practical Microstrip and Triplate Transmission Line ConfigurationsIBM Journal of Research and Development, 1969
- Crosstalk (Noise) in Digital SystemsIEEE Transactions on Electronic Computers, 1967
- Cost-size optima of monolithic integrated circuitsProceedings of the IEEE, 1964