Role of kinetic energy of sputtered particles in thin film formation
- 1 October 1997
- journal article
- Published by Elsevier in Surface Science
- Vol. 386 (1-3) , 231-240
- https://doi.org/10.1016/s0039-6028(97)00313-0
Abstract
No abstract availableKeywords
This publication has 25 references indexed in Scilit:
- Effect of a declination angle of substrate position on magnetron sputter deposition from a YBa2Cu3O7−xtargetApplied Physics Letters, 1989
- Ion-based methods for optical thin film depositionJournal of Materials Science, 1986
- An overview of ion sputtering physics and practical implicationsJournal of Materials Science, 1983
- High-quality submicron niobium tunnel junctions with reactive-ion-beam oxidationApplied Physics Letters, 1980
- The influence of ion sputtering on the elemental analysis of solid surfacesThin Solid Films, 1979
- Effects of substrate orientation and rotation on internal stresses in sputtered metal filmsJournal of Vacuum Science and Technology, 1979
- Composition variations as a function of ejection angle in sputtering of alloysJournal of Vacuum Science and Technology, 1977
- Internal stresses in sputtered chromiumThin Solid Films, 1977
- Theory of Sputtering. I. Sputtering Yield of Amorphous and Polycrystalline TargetsPhysical Review B, 1969
- Energy Distribution of Sputtered Cu AtomsJournal of Applied Physics, 1964