The depth profile analysis of W-Si-N coatings after thermal annealing
- 2 December 2002
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 161 (2-3) , 111-119
- https://doi.org/10.1016/s0257-8972(02)00325-0
Abstract
No abstract availableThis publication has 19 references indexed in Scilit:
- Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered FilmsKey Engineering Materials, 2002
- Ultra-microhardness testing procedure with Vickers indenterSurface and Coatings Technology, 2001
- How is the chemical bonding of W–Si–N sputtered coatings?Surface and Coatings Technology, 2001
- Present and possible future applications of superhard nanocomposite coatingsSurface and Coatings Technology, 2000
- Influence of Substrate Hardness on the Response of W–C–Co-coated Samples to Depth-sensing IndentationJournal of Materials Research, 2000
- Mechanical behaviour of amorphous W–Si–N sputtered films after thermal annealing at increasing temperaturesSurface and Coatings Technology, 2000
- Structural properties, internal stress and thermal stability of nc-TiN/a-Si3N4, nc-TiN/TiSix and nc-(Ti1−yAlySix)N superhard nanocomposite coatings reaching the hardness of diamondSurface and Coatings Technology, 1999
- Apparent reversibility of the β-w → α-w transformationInternational Journal of Refractory Metals and Hard Materials, 1998
- Plastic deformation of nanocrystalline materialsNanostructured Materials, 1997
- High‐temperature oxidation of iron covered by electroless Ni-P coating: A GDOS depth profiling studySurface and Interface Analysis, 1992