Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films
- 1 October 2002
- journal article
- Published by Trans Tech Publications, Ltd. in Key Engineering Materials
- Vol. 230-232, 513-516
- https://doi.org/10.4028/www.scientific.net/kem.230-232.513
Abstract
No abstract availableKeywords
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