Thermal equilibrium process in undoped hydrogenated amorphous silicon and silicon-carbon alloy films

Abstract
We find the thermally induced defects in undoped hydrogenated amorphous silicon carbon (a‐Si1−xCx: H) by electron spin resonance and conductivity measurements. The equilibrium temperature (Te) determined from the annealing temperature‐dependent density of dangling bonds after fast cooling decreases with increasing C content, from 190 °C for hydrogenated amorphous silicon to 150 °C for a‐Si0.82C0.18: H. Possible microscopic mechanisms for the observed thermally induced defects in a‐Si1−xCx: H alloys are discussed.