A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology
- 1 July 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Lightwave Technology
- Vol. 12 (7) , 1185-1191
- https://doi.org/10.1109/50.301811
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- Self-aligned Assembly Technology For Optical Devices Using AuSn Solder Bumps Flip-chip BondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- High silica waveguides on alumina substrates for hybrid optoelectronic integrationIEEE Photonics Technology Letters, 1992
- An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustmentsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- Passive coupling of InGaAsP/InP laser array and singlemode fibres using silicon waferboardElectronics Letters, 1991
- GaAs fiber-optic modules for optical data processing networksJournal of Lightwave Technology, 1991
- Self-aligned flip-chip assembly of protonic devices with electrical and optical connectionsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990
- Silica-based planar waveguides for passive componentsPublished by Optica Publishing Group ,1988
- Very small single-mode ten-fiber connectorJournal of Lightwave Technology, 1988
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969