Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects
- 1 January 2004
- journal article
- Published by Japan Institute of Metals in MATERIALS TRANSACTIONS
- Vol. 45 (3) , 689-694
- https://doi.org/10.2320/matertrans.45.689
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additionsMaterials Science and Engineering: A, 2003
- Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stabilityJournal of Electronic Materials, 2001
- Pb-free solders for flip-chip interconnectsJOM, 2001
- Analytical and Experimental Hybrid Study on Thermal Fatigue Strength of Electronic Solder Joints. 2nd Report. Evaluation by Isothermal Mechanical Fatigue Tests.TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 1998
- Lead (Pb)-free solders for electronic packagingJournal of Electronic Materials, 1994
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994
- Isothermal Fatigue of LCC/PWB InterconnectionsJournal of Electronic Packaging, 1992
- Thermomechanical Fatigue Life Prediction of 63Sn/37Pb SolderJournal of Electronic Packaging, 1992
- Low cycle fatigue of surface-mounted chip-carrier/printed wiring board jointsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989