Low cycle fatigue of surface-mounted chip-carrier/printed wiring board joints
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (4) , 473-479
- https://doi.org/10.1109/33.49004
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Fatigue of 60/40 SolderIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1986
- Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed BoardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Fatigue Life of Leadless Chip Carrier Solder Joints During Power CyclingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Fatigue at High Temperature-Prediction and InterpretationProceedings of the Institution of Mechanical Engineers, 1974
- Fatigue: A complex subject—Some simple approximationsExperimental Mechanics, 1965