Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
- 1 September 2001
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 30 (9) , 1050-1059
- https://doi.org/10.1007/s11664-001-0129-5
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Application of an asymmetrical four point bend shear test to solder jointsJournal of Electronic Materials, 2001
- Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stabilityJournal of Electronic Materials, 2001
- Material issues in electronic interconnects and packagingJournal of Electronic Materials, 2001
- Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloysJournal of Electronic Materials, 2000
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994
- Progress in the design of new lead-free solder alloysJOM, 1993