Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
Top Cited Papers
- 1 October 2000
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (10) , 1122-1136
- https://doi.org/10.1007/s11664-000-0003-x
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- A thermodynamic evaluation of the Ag-Sn systemPublished by Elsevier ,2001
- Tin-silver-copper eutectic temperature and compositionMetallurgical and Materials Transactions A, 2000
- Liquidus temperature determination in multicomponent alloys by thermal analysisMetallurgical and Materials Transactions A, 2000
- An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substratesJournal of Electronic Materials, 1999
- A thermodynamic study on the AgSbSn systemJournal of Alloys and Compounds, 1996
- On the Sn-Bi-Ag ternary phase diagramJournal of Electronic Materials, 1994
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994
- Reactive Wetting and Intermetallic FormationPublished by Springer Nature ,1993
- SGTE data for pure elementsCalphad, 1991
- Optimization of phase diagrams by a least squares method using simultaneously different types of dataCalphad, 1977