Dependency of Adhesion Behavior on Thermal Stress Distribution in Photoresist Micropatterns
- 1 February 1993
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 32 (2R)
- https://doi.org/10.1143/jjap.32.1020
Abstract
We report an excellent correlation between adhesive behavior in HF aqueous solution and internal distribution of thermal stress in a photoresist pattern. The stress distribution was analyzed using the two-dimensional finite element modeling in the cross section of the photoresist pattern. The large envelope shape, which indicates weak adhesion, was confirmed by the concentration of stress at the resist-substrate interface. In particular, the hardened layer of the photoresist pattern surface has the effect of forming the two-step shape of the etching envelope due to isotropic and lateral intrusion.Keywords
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