Creation and evaluation of compact models for thermal characterisation using dedicated optimisation software
- 20 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1 (10652221) , 189-200
- https://doi.org/10.1109/stherm.1999.762447
Abstract
The collaborative European project DELPHI, completed in November 1996, was concerned with the creation and experimental validation of thermal models for a range of electronic parts. Many DELPHI principles and results have been extensively discussed in open literature over the last five years (e.g. Rosten et al. 1997; Lasance et al. 1997); however, one of the topics that has not been treated in sufficient detail is the creation and evaluation or the compact models themselves. This paper tries to fill this gap. We have shown that a dedicated optimisation tool can have the potential to create models and to investigate the consequences of changing the model or the set of boundary conditions. It paves the way to thermal data-on-demand, a procedure by which a supplier provides the end-user with a model that is either suitable for all applications or tuned to a specific application, in almost real time.Keywords
This publication has 7 references indexed in Scilit:
- Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methodsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Thermal characterization of electronic parts with compact models: interpretation, application, and the need for a paradigm shiftPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- The world of thermal characterization according to DELPHI-Part I: Background to DELPHIIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
- Compact models for accurate thermal characterization of electronic partsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
- The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methodsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
- Thermal characterization of electronic devices with boundary condition independent compact modelsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995
- Interior Point Approach to Linear, Quadratic and Convex ProgrammingPublished by Springer Nature ,1994