The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods
- 1 January 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 20 (4) , 392-398
- https://doi.org/10.1109/95.650928
Abstract
No abstract availableThis publication has 18 references indexed in Scilit:
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