Issues in validating package compact thermal models for natural convection cooled electronic systems
- 22 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Development, validation and application of a thermal model of a plastic quad flat packPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603 and PowerPC 604 RISC microprocessorsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1998
- Thermal characterization of electronic devices with boundary condition independent compact modelsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995
- PCB glass-fibre laminates: Thermal conductivity measurements and their effect on simulationJournal of Electronic Materials, 1990
- theta /sub jc/ characterization of chip packages-justification, limitations, and futureIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Mirage-effect measurement of thermal diffusivity. Part I: experimentCanadian Journal of Physics, 1986