Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation
Top Cited Papers
- 1 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 05695503,p. 603-610
- https://doi.org/10.1109/ectc.2003.1216343
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Reliability and Au embrittlement of lead free solders for BGA applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Reliability assessment of flip-chip assemblies with lead-free solder jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Do chip size limits exist for DCA?IEEE Transactions on Electronics Packaging Manufacturing, 1999
- An efficient approach to predict solder fatigue life and its application to SM- and area array componentsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1997
- Thermomechanical Fatigue of 63Sn-37Pb Solder JointsPublished by Springer Nature ,1993
- Creep deformation and rupture properties of unirradiated Zircaloy-4 nuclear fuel cladding tube at temperatures of 727 to 857 KJournal of Nuclear Materials, 1990
- Deformation of PbSn eutectic alloys at relatively high strain ratesActa Metallurgica, 1979