Electromigration in vacuum evaporated Cu films
Open Access
- 1 June 1993
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 70-71, 639-643
- https://doi.org/10.1016/0169-4332(93)90594-2
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Activation energy for electromigration in Cu filmsApplied Physics Letters, 1991
- Selective electroless copper for VLSI interconnectionIEEE Electron Device Letters, 1989
- A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2Journal of Applied Physics, 1986
- Activation energy for electrotransport in thin aluminum films by resistance measurementsJournal of Physics and Chemistry of Solids, 1976
- Electromigration effects in aluminum alloy metallizationJournal of Electronic Materials, 1974
- RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMSApplied Physics Letters, 1968